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GIGABYTE B860M AORUS ELITE WIFI6E LGA1851 Micro ATX Motherboard Original price was: 36,900.00 ৳ .Current price is: 32,800.00 ৳ .
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GIGABYTE B860M AORUS ELITE WIFI6E ICE LGA1851 Micro ATX Motherboard Original price was: 38,000.00 ৳ .Current price is: 33,000.00 ৳ .

GIGABYTE B860 EAGLE WIFI6E DDR5 INTEL GAMING MOTHERBOARD

Original price was: 35,500.00 ৳ .Current price is: 33,500.00 ৳ .

GIGABYTE B860 EAGLE WIFI6E DDR5 Intel Gaming Motherboard – Specifications

  • CPU Support: Intel 12th & 13th Gen Core Processors (LGA 1700)

  • Memory: 4 × DDR5 DIMM slots, up to 128GB

  • Storage: 3 × M.2 slots, 6 × SATA 6Gb/s ports

  • Expansion Slots: 1 × PCIe 5.0 x16, 2 × PCIe x1

  • Networking: Intel WiFi 6E, 2.5Gb Ethernet

  • Audio: High-definition audio with ALC1220-VB codec

  • USB Ports: Multiple USB 3.2 Gen2 & USB 2.0 ports

  • Form Factor: ATX

  • Special Features: Advanced thermal design, Q-Flash Plus, RGB Fusion support

Description

GIGABYTE B860 EAGLE WIFI6E DDR5 Intel Gaming Motherboard

Take your gaming and productivity to the next level with the GIGABYTE B860 EAGLE WIFI6E DDR5 motherboard. Designed for Intel’s latest processors, this motherboard combines cutting-edge performance, superior connectivity, and robust durability to deliver an unmatched computing experience.

Featuring DDR5 memory support, lightning-fast data transfer, and WiFi 6E technology, it ensures ultra-low latency gaming and seamless multitasking. The motherboard’s advanced thermal design keeps your system cool even during intense gaming sessions, while its high-quality components provide reliability for years to come.

Whether you’re building a high-performance gaming rig or a powerful workstation, the B860 EAGLE WIFI6E offers the speed, stability, and connectivity you need to stay ahead of the competition.

Key Features:

  • Supports 12th/13th Gen Intel Core processors (LGA 1700)

  • DDR5 memory support for faster performance

  • Integrated WiFi 6E for ultra-fast wireless connectivity

  • PCIe 5.0 ready for next-gen graphics cards

  • Robust thermal design with advanced heatsinks

  • Multiple USB and M.2 slots for storage and expansion

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