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GIGABYTE B760M DS3H DDR5 13TH AND 12TH GEN INTEL MOTHERBOARD Original price was: 19,500.00 ৳ .Current price is: 16,500.00 ৳ .
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gigabyte-b760m-gaming-x-gen5
Gigabyte B760M GAMING X GEN5 (Wi-Fi 6E) DDR5 Gaming Motherboard Original price was: 22,000.00 ৳ .Current price is: 20,000.00 ৳ .

GIGABYTE B760M G AX DDR5 Intel LGA1700 Micro ATX Motherboard

Original price was: 25,000.00 ৳ .Current price is: 20,000.00 ৳ .

GIGABYTE B760M G AX DDR5 Micro ATX Motherboard – Key Specifications:

  • CPU Support: Intel 13th & 12th Gen LGA1700 processors

  • Form Factor: Micro ATX

  • Memory: 4 x DDR5 DIMM slots, up to 128GB, Dual Channel

  • PCIe Slots: 1 x PCIe 4.0 x16, 1 x PCIe 3.0 x16, 1 x PCIe 3.0 x1

  • Storage: 4 x SATA 6Gb/s, 2 x M.2 NVMe slots

  • Networking: Wi-Fi 6E, 2.5Gb Ethernet

  • Audio: High Definition Audio with Realtek ALC1220-VB codec

  • USB Ports: Multiple USB 3.2 Gen 2 & USB 2.0 ports

  • Expansion & Features: Reinforced PCIe slots, Smart Fan 6, RGB Fusion 2.0

Description

GIGABYTE B760M G AX DDR5 Intel LGA1700 Micro ATX Motherboard

Unlock the full potential of your Intel 12th and 13th Gen processors with the GIGABYTE B760M G AX DDR5 Motherboard. Designed for gamers, creators, and PC enthusiasts, this Micro ATX motherboard delivers blazing-fast performance, stable power delivery, and advanced connectivity.

Featuring DDR5 memory support, ultra-responsive PCIe 4.0 slots, and Wi-Fi 6E for seamless online gaming, it ensures a smooth and efficient computing experience. The robust build quality, reinforced PCIe slots, and optimized thermal design keep your system cool under heavy workloads.

Whether you’re building a high-performance gaming rig or a reliable workstation, the GIGABYTE B760M G AX provides the perfect foundation for your next PC upgrade.

Key Features:

  • Supports Intel 13th & 12th Gen LGA1700 CPUs

  • DDR5 Memory Support for faster speeds and better efficiency

  • PCIe 4.0 for next-gen graphics cards and storage devices

  • Wi-Fi 6E & Bluetooth 5.2 for fast, stable wireless connections

  • Enhanced Thermal Design with heatsinks for VRM and chipset

  • High-Quality Components for durability and long-lasting performance

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